300W Hot air rework station with automatic cooling system.
LED digital display, showing current temperature and status.
MCU confirms fast heat up, accurate and stable control on temperature.
Temperature range: 100-500¡C.
Suitable for desoldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA.
Includes three nozzles.
Model No. SD007
1 year